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Study on thermal comfort of wood tabletop materials

Authors

  • BAI JUE

    Nanjing Forestry University, China

  • GUAN HUIYUAN

    Nanjing Forestry University, China

Post Views: 277
Posted in WOOD RESEARCH Volume 67, Number 2, 2022Tagged contact temperature, device simulation, subjective evaluation, thermal comfort, Wooden tabletop

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Cite This Article

JUE, B. & HUIYUAN, G. (2022): Study on thermal comfort of wood tabletop materials. In: Wood Research 67 (2), 326-339 pp., available at: doi.org/10.37763/wr.1336-4561/67.2.326339

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